Integrating Research and Sevelopment, Production and Sales

EMI Shielding Film

Solving electromagnetic interference

The copper foam we produce can be used as electromagnetic shielding material. Copper foam is a lightweight, porous copper material that is very conductive and ductile. Foamed copper has good electrical conductivity, which enables it to effectively shield electromagnetic waves and can be used to make electromagnetic shielding materials.
Our electromagnetic shielding films are widely used in many fields, such as military, communication, automotive electronics, medical treatment, etc. In the context of the rapid development of modern electronic products such as smartphones, wearable devices, and automotive electronics, the market demand for electromagnetic shielding films continues to grow.

  • Independent intellectual property rights of our electromagnetic shielding film
  • Independent research and development of coating machines and roll-to-roll PVD equipment.
    *Thickness can be customized for production

Environmental adaptability

Halogen-free PASS
Meet ROSH requirements PASS
comply with the laws and regulations of REACH PASS
Suitable for lead-free reflow soldering YES
Products Categories
Products Description

Environmental adaptability

EMI Shielding Film Structure

Product property

performance Unit Standard Testing method
Shielding effectiveness dB >60 GB/T 30142-2013
Insulation resistance >6 insulation resistance tester
conductivity(grounding Ф1.0) Ω <1 Four-terminal resistance measurement method
soldering resistance No delamination JIS C 6471 9.3(Solder Float 288℃,10sec)
Resistance to bending >100K JIS C 6471 Appendix C
Peel strength(connect with PI) N/cm >8 IPC-TM-650-2.4.9
Peel strength(connect with Cu) N/cm >8 IPC-TM-650-2.4.9
Wear resistance(Pencil hardness test) 2H IPC-TM-650-2.4.27.2
Corrosion resistance No delamination JIS C 6471 9.2
Anti-flaming OK VTM-0
hygroscopicity % <1.1 IPC-TM-650-2.6.2

Note: The table above is a test for reference only

Working condition of faster compression

working condition of faster compression

Storage condition

Store in original packing:①storage temperature:2℃~10℃   ②relative humidity≤70%   ③shelf-life:3 months

Matters need attention

Production operation process:

  1. the material should be unpacked at 2℃~10℃ and thawed for 4 hours before usage.
  2. It is recommended to finish pre-fix and hot press within 7 days after opening. Operation temperature≤25℃, relative humidity≤70%.
  3. Products fitted with a shield film should be baked before assembly (SMT).Piling up less than 5NPL. Baking time no less than 1.5 hours at 160℃
  4. design recommendation: If the bonded area on the FPC board is a large copper area, it is recommended to design it in a grid pattern to improve its adhesion strength and hence avoid excessive stress due to thick copper layer during heating process, resulting in poor bubbles during SMT thermal shock.

Product workshop

Coating machine

coating machine (1) coating machine (2)

Vacuum coating equipment

coating machine (3) coating machine (4)

Product performance testing

solvent resistance

1. Experimental method:
The electromagnetic shielding film was attached on the PI surface of the FCCL and then after 1 hour of solidification at 160℃,the sample was immersed in different solutions for ultrasonic cleaning. 10 minutes later, the sample was taken out and dried in air. The observation of the color changing was proceededby using a cross grating knife to cut grids on the sample surface. The adhesion force was tested by sticking a 3M600 tape on the top of the EMS film and then tearing off vertically.

2. Test results:qualified

Experimental chemicals ultrasonic frequency Immersion time Griding standard
ethyl alcohol 40KHZ 10min Vertical 10
Lateral 10
butanone 10min (1mm per grid)

solvent resistance (2)solvent resistance (3)

solvent resistance (4) solvent resistance (1)

Resistance to acid and base

1.Experimental method:
The electromagnetic shielding film was attached on the PI surface of the FCCL and then after 1 hour of solidification at 160℃,the sample was immersed in different solutions for ultrasonic cleaning. 10 minutes later, the sample was taken out and dried in air. The observation of the color changing was proceededby using a cross grating knife to cut grids on the sample surface. The adhesion force was tested by sticking a 3M600 tape on the top of the EMS film and then tearing off vertically.

2.Test results:(qualified)

Experimental chemicals ultrasonic frequency Immersion time Griding standard
10% NaOH 40KHZ 10min Vertical10 lateral10 (1mm per grid)
10% H2SO4 10min
2mol/L HCl 10min

Thermal expansion coefficient

1.Experimental method:
The pitch-row was measured by punching 4 positioning holes on the EMS film, splitting the film into transverse direction (TD) and machine direction (MD). Afterwards, the EMS film was compressed on the copper foil, driedfor 1 hour and then cooled down to measure its pitch-row. Then the thermal shrinkage rate can be calculated.

2.Test results :

Project EMIF22 notes
Thermal shrinking rate

(160℃ 1H)

MD direction 0.1% EMS film
TD direction 0.1%
Thermal shrinking rate

(After flow soldering)

MD direction 0.1% EMS film
TD direction 0.1%

Thermal expansion coefficient

Pencil hardness

1.Test method:
The electromagnetic shielding film was attached on the PI surface of the FCCL. After 1 hour of solidification at 160℃, the sample was tested by a pencil hardness tester with pulling speed at 0.5-1.0mm/s and pencil angle at 45°.

2.Test results:

Project EMIF22
pencil hardness 2H

Pencil hardness (2) Pencil hardness (1)

Printability

1.Sample preparation:The EMS film was bonded on the PI film surface of FPC board and cleaned with ethyl alcohol. Next, character ink was printed on the EMS film surface and the test was performed after solidification.

2.Evaluation project:3M tape 600#, 90° vertical uniform stripping test

3.Evaluation results:no characters peeledoff

project EMIF22
printability qualified

Pencil hardness

Grounding resistance

Test method:the EMS film was bonded on the resistance testing module to measure its grounding resistance by a milliohm meter

Sample No. 1 2 3 4 5
Pore size(φ1) mΩ 28.91 27.15 26.16 25.33 27.84

Grounding resistance (1)Grounding resistance (1)

Insulation resistance

1.Test method:
The EMS film was bonded on the PI film surface of FPC board. Next, two small steel plate was attached on the sample surface (distance 1cm).The multimeter was applied to measure the electrical resistance between two steel plates.

2.Test results: > 6MΩ

Insulation resistance

Solder resistance

1. Test method:
The EMS film was bonded on the PI film surface of FPC board. After solidification at 160℃ for 1 hour, the sample was taken to soler float at 288℃ for 10s. Repeat this process 5 times.

2. Test results: no bubble blistering and delamination.

Solder resistance (1) Solder resistance (2)

Shielding effectiveness

1. Test method:GB/T 30142-2013

2.Test instrument:

Project EMIF22
Shielding effectiveness 65db average

Shielding effectiveness

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